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Design Curves for Transient Heat Flow in Semiconductor Devices

J. A. Cooper

出版	Purdue University, School of Electrical Engineering, 1992
URL	http://books.google.com.hk/books?id=0Z1IHQAACAAJ&hl=&source=gbs_api

註釋

Abstract: "We have performed a numerical simulation of heat flow in a cylindrical solid having a geometry typical of semiconductor devices. We present curves of temperature as a function of time, normalized to the thermal constants and the surface heat flux. These curves can be used in the design of semiconductor devices where transient or steady state temperature rise is a consideration."