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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Karl J. PuttlitzKathleen A. Stalter
出版CRC Press, 2004-02-27
主題Technology & Engineering / Electronics / MicroelectronicsTechnology & Engineering / Materials Science / GeneralTechnology & Engineering / Electronics / GeneralTechnology & Engineering / MetallurgyTechnology & Engineering / Microwaves
ISBN082475249X9780824752491
URLhttp://books.google.com.hk/books?id=7FX5LkxfRpwC&hl=&source=gbs_api
EBookSAMPLE
註釋This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.