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Electrodeposition of Nickel from Low Temperature Sulfamate Electrolytes. Part 1
J. J. Kelly
John T. Hachman
Albert Alec Talin
Steven Howard Goods
其他書名
Electrochemistry and Film Stress
出版
United States. Department of Energy
, 2005
URL
http://books.google.com.hk/books?id=8puFAQAACAAJ&hl=&source=gbs_api
註釋
The film stress of Ni films deposited at near-ambient temperatures from sulfamate electrolytes was studied. The particulate filtering of the electrolyte, a routine industrial practice, becomes an important deposition parameter at lower bath temperatures. At 28 C, elevated tensile film stress develops at low current densities (
