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Mechanics of Bonded and Adhesively Bonded Joints
Xiang-fa Wu
出版Elsevier, 2024-11-27
主題Technology & Engineering / Chemical & BiochemicalScience / Mechanics / Thermodynamics
ISBN03239584789780323958479
URLhttp://books.google.com.hk/books?id=A3SyEAAAQBAJ&hl=&source=gbs_api
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註釋Mechanics of Bonded and Adhesively Bonded Joints provides an overview of the most effective analytical solutions for common bonded and adhesively bonded joints. In each type of joint analyzed, the analytical stress solution is formulated and final numerical results are provided for easy use and self-learning. Analytical and high-efficiency semianalytical methods for interfacial stress and fracture analysis of various bonded and adhesively bonded joints are provided as are related joint design insights and advanced applications in structures and devices. Fundamentals of elasticity, fracture mechanics, and viscoelasticity are also introduced. The book starts by introducing different kinds of joining technology and how joints are classified, followed by chapters looking at the fundamentals of elasticity and fracture mechanics. From there the book explores various analytical solutions to interfacial stresses, strength and toughness of bonded joints, and the viscoelastic mechanics of adhesives and concludes with a chapter covering the applications of these joining theories, exploring their use in smart materials, microelectronics packaging, surface coatings, laminated composite materials, and more. - Synthesizes the literature on analytical solutions and applications for bonded and adhesively-bonded joints - Provides pros, cons, and best applications for each method discussed - Covers the fundamentals of elasticity, fracture mechanics, viscoelasticity, and other mechanics of materials phenomena