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Dynamics of High- and Low -Pressure Plasma Remediation

Xudong "Peter." Xu

出版	University of Illinois at Urbana-Champaign, 1999
URL	http://books.google.com.hk/books?id=Dt5njwEACAAJ&hl=&source=gbs_api

註釋

Plasma remediation is an efficient and promising technology to destroy toxic and greenhouse gases. In this work we computationally study the dynamics of high-pressure dielectric barrier discharges (DBDs) and low-pressure plasma processing reactors. The high-pressure systems are examined in the context of volatile organic compound (VOC) and NOx remediation. The low-pressure systems are studied in the context of the consumption and generation of perfluorocompounds (PFCs) in an inductively coupled plasma (ICP) etching reactor and abatement of PFCs in a plasma burn box. The plasma kinetic processes are discussed with the goal of providing insight for optimizing efficiencies.