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出版Springer Science & Business Media, 1994-01-31
主題Computers / Systems Architecture / GeneralTechnology & Engineering / ManufacturingComputers / Programming / AlgorithmsComputers / Information TechnologyTechnology & Engineering / Technical & Manufacturing Industries & Trades
ISBN04420150549780442015053
URLhttp://books.google.com.hk/books?id=HgqTNwFkfeEC&hl=&source=gbs_api
EBookSAMPLE
註釋The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.