登入選單
返回Google圖書搜尋
其他書名
Electrical and Layout Perspectives
出版Now Publishers Inc, 2011-06-20
主題Computers / Software Development & Engineering / Systems Analysis & DesignComputers / Computer EngineeringTechnology & Engineering / ElectricalTechnology & Engineering / Electronics / Circuits / GeneralTechnology & Engineering / Electronics / Circuits / Integrated
ISBN16019845889781601984586
URLhttp://books.google.com.hk/books?id=IVqN7ZvrUXUC&hl=&source=gbs_api
EBookSAMPLE
註釋With the increasing scalability of semiconductor processes, the higher-level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system. System-in-Package: Electrical and Layout Perspectives focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as IO (input/output cell) placement and routing for redistribution layer, escape, and substrate. System-in-Package: Electrical and Layout Perspectives is an invaluable reference for EDA researchers, professionals and graduate students.