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Integrated Modeling of Chemical Mechanical Planarization/Polishing (CMP) for Integrated Circuit Fabrication
Jianfeng Luo
其他書名
From Particle Scale to Die and Wafter Scales
出版University of California, Berkeley, 2003
URLhttp://books.google.com.hk/books?id=JGVOAQAAMAAJ&hl=&source=gbs_api