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Integrated Interconnect Technologies for 3D Nanoelectronic Systems
Muhannad S. BakirJames D. Meindl
出版Artech House, 2009
主題Technology & Engineering / Electronics / GeneralTechnology & Engineering / Electronics / Circuits / GeneralTECHNOLOGY & ENGINEERING / Electronics / DigitalTechnology & Engineering / Electronics / MicroelectronicsTechnology & Engineering / Engineering (General)Technology & Engineering / Nanotechnology & MEMS
ISBN15969324739781596932470
URLhttp://books.google.com.hk/books?id=OtY-66XCMuYC&hl=&source=gbs_api
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註釋This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.