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Semiconductor Packaging
Andrea ChenRandy Hsiao-Yu Lo
其他書名
Materials Interaction and Reliability
出版CRC Press, 2016-04-19
主題Technology & Engineering / Electronics / GeneralTechnology & Engineering / Electronics / Circuits / GeneralTechnology & Engineering / Materials Science / General
ISBN10002186199781000218619
URLhttp://books.google.com.hk/books?id=Pef5DwAAQBAJ&hl=&source=gbs_api
EBookSAMPLE
註釋In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.