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Analysis of the Mechanical Properties of DGEBF/4,4'-DDS Thermoset Systems as a Function of Cure Rate

Chase Byron Thompson

出版	University of Southern Mississippi, 2015
URL	http://books.google.com.hk/books?id=S2XujwEACAAJ&hl=&source=gbs_api

註釋

The relationship between macroscopic mechanical and thermal properties and ramp rate during cure of epoxy-amine systems consisting of the epoxide resin digylcidyl ether of bisphenol F (DGEBF, provided Hexion specialty chemicals) and 4,4- diaminodiphenyl sulfone (4,4-DDS, provided by Atul Sulpho) were probed using Dynamic Mechanical Analysis (DMA), Positron Annihilation Lifetime Spectroscopy (PALS), and compression testing. These systems were cured in a programmable oven; the samples were heated from 35°C to 180°C at ramp rates of 0.5, 1.0, 1.5, 2.0, 2.5, 5.0, 10, and 15°C/min. Even as the ramp rates during the cure of these materials was changed, there was very little in properties such as crosslink density, glass transition temperature (Tg), free hole volume, or modulus in the samples. --Page iv.