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Heterogeneous Integrations
John H. Lau
出版
Springer
, 2019-04-03
主題
Technology & Engineering / Electronics / General
Technology & Engineering / Electronics / Circuits / General
Technology & Engineering / Electrical
ISBN
9811372241
9789811372247
URL
http://books.google.com.hk/books?id=SCGQDwAAQBAJ&hl=&source=gbs_api
EBook
SAMPLE
註釋
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.