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Characterization of Microstructural Evolution of Crept, Aged, and Thermomechanically Fatigued Eutectic Sn-Ag Solder Joints Using Orientation Imaging Microscopy

Adwait Uday Telang

出版	Michigan State University. Department of Chemical Engineering and Materials Science, 2002
URL	http://books.google.com.hk/books?id=SgkAVEUG45gC&hl=&source=gbs_api