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Atomic Layer Deposition Applications 3
註釋Editors Londergan (Qualcomm MEMS Technologies), van der Straten (IBM Research), Bent (Stanford U.), Elam (Argonne National Laboratory), De Gendt (IMEC) and Kang (Samsung Electronics) have collected these research papers, which were originally presented at the third symposium on Atomic Layer Deposition Applications in 2007. Contributors in the field explore the latest technologies used to deposit ultra-thin coatings over precise 3-dimensional topography, emphasizing the use of emerging methods to expand the current spectrum of research. Written primarily for engineers and research scientists already familiar with atomic layer deposition, this book concentrates on such topics as ALD equipment and process integration, coatings on porous materials and gate stack applications.