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Fatigue Behavior of Copper with Intermediate Surface Layer Removal
Y. Nakano
BI. Sandor
出版
ASTM International
, 1974
URL
http://books.google.com.hk/books?id=d7t7zgEACAAJ&hl=&source=gbs_api
註釋
The effect of single and periodic intermediate surface layer removal on the fatigue behavior of oxygen-free, high-conductivity copper was studied in the life range of 105 to 2 x 106 cycles.The fatigue tests were conducted at room temperature, in tension-compression, under load control, and without mean load.The surface layer removal was accomplished by electropolishing.The variables of the test conditions were the engineering stress range, the average grain size, and the atmosphere (air and argon gas).
