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Development of a Rubber Toughened Epoxy Adhesive Loaded with Carbon Nanotubes, for Aluminium-polymer Bonds
註釋This thesis describes the formulation of a ternary thermosetting adhesive which consistsof a diglycidyl ether of bisphenol-A (DGEBA) epoxy resin cured with 3,3?-diaminodiphenyl sulphone (3,3?-DDS) hardener and modified through the addition of carboxyl-terminated butadiene-acrylonitrile (CTBN) rubber and multi-walled carbon nanotubes(MWCNTs). Processing implications of the novel adhesive in the film form areconsidered in order to manufacture bonded specimens for characterisation of theadhesive performance in structural joints. The ternary blend which represents the noveladhesive formulation is also characterised in bulk form. The cure kinetics behaviour of the novel ternary blend is investigated usingdifferential scanning calorimetry which shows 10% reduction in the total reactivity, andtherefore reduced final crosslinking density, with the addition of the carbon nanotubes. A cure kinetics model is developed for the novel ternary thermoset. Fromcharacterisation of cast samples, a toughening effect of the phase separated rubberparticles is observed, from 144 to 317 J/m2, with a further increase to 551 J/m2in thepresence of the carbon nanotubes. In the absence of rubber, the nanotubes alone producea minimal effect upon the thermo-mechanical and mechanical characteristics of theresin. The morphology of the cured material is affected by the presence of thenanoparticles, resulting in the reduction of the mean rubber particle size from 3?m tobelow 1?m. The electrical conductivity of the cured resin samples is found to increaseby six orders of magnitude, up to 3.6 x10-3S/m in the ternary blend for a low carbonnanotube concentration of 0.3 wt%. DCB and ELS tests are used to study the performance of the novel adhesive in ajoint configuration. The adhesive joint strength is dependent on the substrate type aswell as on the surface preparation. The novel adhesive is also examined under fatigue ina?bonded crack retarder? application.