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Area Array Package Design
Ken Gilleo
其他書名
Techniques in High-density Electronics
出版McGraw-Hill, 2004
主題Technology & Engineering / ElectricalTechnology & Engineering / Electronics / GeneralTechnology & Engineering / Electronics / MicroelectronicsTechnology & Engineering / Industrial EngineeringTechnology & Engineering / Industrial Design / PackagingTechnology & Engineering / Manufacturing
ISBN00714282759780071428279
URLhttp://books.google.com.hk/books?id=hARTAAAAMAAJ&hl=&source=gbs_api
註釋This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.