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Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications

Michael A. Stelzer

出版	Booksurge Publishing, 2005-08-17
主題	Education / Computers & TechnologyMathematics / General
ISBN	14196061319781419606137
URL	http://books.google.com.hk/books?id=iiSNzgEACAAJ&hl=&source=gbs_api

註釋

This research text provides a detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. This relationship is used together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. The book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.