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Thermal Reliability of Power Semiconductor Device in the Renewable Energy System
Xiong Du
Jun Zhang
Gaoxian Li
Yaoyi Yu
Cheng Qian
Rui Du
出版
Springer Nature
, 2022-07-08
主題
Technology & Engineering / Power Resources / General
Technology & Engineering / Electronics / Circuits / General
Technology & Engineering / Machinery
Technology & Engineering / Electronics / General
Technology & Engineering / Electrical
ISBN
9811931321
9789811931321
URL
http://books.google.com.hk/books?id=ijx6EAAAQBAJ&hl=&source=gbs_api
EBook
SAMPLE
註釋
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.