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Microstructure Evolution of Tin Under Electromigration Studied Bysynchrotron X-Ray Micro-diffraction

N. TamuraJ. R. LloydK.-N. TuAlbert T. Wu

出版	Lawrence Berkeley National Laboratory, 2005
URL	http://books.google.com.hk/books?id=k7KiAQAACAAJ&hl=&source=gbs_api

註釋Under constant current electromigration, white tin(?-Sn)exhibited a resistance drop of up to 10 percent. It has a body centertetragonal (BCT) structure, and the resistivity along the aand b axes is35 percent smaller than that along the c axis. Microstructure evolutionunder electromigration could be responsible for the resistance drop. Synchrotron radiation white beam x-ray microdiffraction was used to studythis evolution. Both stress and grain orientation was studied. Grain-by-grain analysis was obtained from the diffracted Laue patternsabout the changes of grain orientation during electromigration testing inex-situ and in-situ samples. We observed that high resistance grainsreorient with respect to the neighboring low resistance grains, mostlikely by grain rotation of the latter. A different mechanism ofmicrostructure evolution under electromigration from the normal graingrowth is proposed and discussed.