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Advances in 3D Integrated Circuits and Systems
Hao Yu (Electrical engineer)Chuan Seng Tan
出版World Scientific, 2016
主題Technology & Engineering / Electronics / Circuits / GeneralTechnology & Engineering / Electronics / Circuits / IntegratedTechnology & Engineering / Electronics / Circuits / Logic
ISBN98146990129789814699013
URLhttp://books.google.com.hk/books?id=wDvwsgEACAAJ&hl=&source=gbs_api
註釋3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.